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ESDA8P30-1T2 Datasheet(PDF) 7 Page - STMicroelectronics |
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ESDA8P30-1T2 Datasheet(HTML) 7 Page - STMicroelectronics |
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7 / 11 page ![]() 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 12. Stencil opening recommendation L T W b. General design rule ◦ Stencil thickness (T) = 75 ~ 125 μm ◦ WT≥1.5 ◦ L × W 2TL +W ≥0.66 1. Reference design a. Stencil opening thickness: 100 µm b. Stencil opening for leads: Opening to footprint ratio is 90% Figure 13. Recommended stencil window position in mm 1.47mm 0.47mm 0.52mm 0.43mm 0.52mm 0.015mm 0.015mm Footprint Stencil window ESDA8P30-1T2 Recommendation on PCB assembly DS12517 - Rev 3 page 7/11 |
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