STM32H753II datasheet(354/361 Pages) STMICROELECTRONICS

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DS12117 Rev 8

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STM32H753xI

Revision history

359

Revision history

Table 230. Document revision history

Date

Revision

Changes

22-Jun-2017

Initial release.

27-Sep-2017

Updated list of features.

Changed datasheet status to “production data”.

Added UFBGA169 and TFBGA100 packages as well as notes related to TFBGA100

and UFBGA169 status on cover page and in Table 2: STM32H753xI features and

peripheral counts.

Differentiated number of GPIOs for each package in Table 2: STM32H753xI features

and peripheral counts.

Updated Error code correction (ECC) in Section 3.3.3: Embedded SRAM.

Change PWR_CR3 into PWR_D3CR in Section 3.5.1: Power supply scheme.

Updated Section 3.12: Nested vectored interrupt controller (NVIC).

Added Table 4: DFSDM implementation in Section 3.23: Digital filter for sigma-delta

modulators (DFSDM).

Changed PC2/3 to PC2/3_C and VDD33USB to VDD in Figure 4: LQFP100 pinout.

Changed PC2/3 to PC2/3_C in Figure 6: LQFP144 pinout. Changed PC2/3 to

PC2/3_C in Figure 8: LQFP176 pinout. Changed PC2/3 to PC2/3_C in Figure 10:

LQFP208 pinout.

Table 8: Pin/ball definition:

– Modified PA7, PC4, PC5, PB1, PG1, PE7, PE8 and PE9 I/O structure

– TFBGA240 +25: removed duplicate occurrence of F1, F2 and P17 pin; added

notes related to F1, F2, G2 pin connection; added note on E1, L16, L17, M16,

M17, K16, K17, N17.

– UFBGA176+25: changed G10 pin name to VSS.

– Added note to VREF+ pin.

Added current consumption corresponding to 125 °C ambient temperature in

Section 6.3.6: Supply current characteristics.

Replaced FMC_CLK by FMC_SDCLK in Section : SDRAM waveforms and timings.

Changed description of the last five fS values and updated tLATRINJin Table 86: ADC

characteristics.

For TFBGA100, TFBGA240+25 and UFBGA169, updated thermal resistance power-

junction in Table 229: Thermal characteristics as well as power dissipation in

Table 23: General operating conditions.

23-Oct-2017

Total current consumption changed to 4 µA minimum in Features.

Updated Figure 7: UFBGA169 ballout.

Updated dpad and dsm in Table 228: TFBGA240+25 - Recommended PCB design

rules (0.8 mm pitch BGA).

STM32H753II Datasheet(PDF) 354 Page - STMicroelectronics

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