PPJS6421

January 6,2022

PJS6421-REV.01

Page 2

Electrical Characteristics (TA=25

o

C unless otherwise noted)

PARAMETER

SYMBOL

TEST CONDITION

MIN.

TYP.

MAX.

UNITS

Static

Drain-Source Breakdown Voltage

BVDSS

VGS=0V, ID=-250uA

-20

-

-

V

Gate Threshold Voltage

VGS(th)

VDS=VGS, ID=-250uA

-0.3

-0.55

-1

Drain-Source On-State Resistance

RDS(on)

VGS=-4.5V, ID=-5A

-

21

26

m

Ω

VGS=-2.5V, ID=-4A

-

26

32

VGS=-1.8V, ID=-3A

-

32

40

Zero Gate Voltage Drain Current

IDSS

VDS=-20V, VGS=0V

-

-

-1

uA

Gate-Source Leakage Current

IGSS

VGS=+10V, VDS=0V

-

-

+100

nA

Dynamic(Note 5)

Total Gate Charge

Qg

VDS=-10V, ID=-5A,

VGS=-4.5V(Note 1,2)

-

16.5

-

nC

Gate-Source Charge

Qgs

-

2.6

-

Gate-Drain Charge

Qgd

-

3.1

-

Input Capacitance

Ciss

VDS=-15V, VGS=0V,

f=1MHZ

-

1620

-

pF

Output Capacitance

Coss

-

220

-

Reverse Transfer Capacitance

Crss

-

160

-

Turn-On Delay Time

td(on)

VDD=-10V, ID=-1A,

VGS=-4.5V,

RG=25

Ω(Note 1,2)

-

22

-

ns

Turn-On Rise Time

tr

-

25

-

Turn-Off Delay Time

td(off)

-

138

-

Turn-Off Fall Time

tf

-

53

-

Drain-Source Diode

Maximum Continuous Drain-Source

Diode Forward Current

IS

---

-

-

-2

A

Diode Forward Voltage

VSD

IS=-1A, VGS=0V

-

-0.7

-1

V

NOTES :

1.

Pulse width<300us, Duty cycle<2%.

2.

Essentially independent of operating temperature typical characteristics.

3.

RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is

defined as the solder mounting surface of the drain pins mounted on a 1 inch FR-4 with 2oz. square pad of copper.

4.

The maximum current rating is package limited.

5.

Guaranteed by design, not subject to production testing.