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CHA0612 Datasheet(PDF) 21 Page - Cree LED

Part # CHA0612
Description  XLamp® CHA0612 LED
PDF  25 Pages
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Manufacturer  CREELED [Cree LED]
Direct Link  https://www.cree-led.com/
Logo CREELED - Cree LED

CHA0612 Datasheet(HTML) 21 Page - Cree LED

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XLAMP® CHA0612 LED
© 2022 Cree LED. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks, and the
Cree LED logo is a trademark, of Wolfspeed, Inc. XLamp® and EasyWhite® are registered trademarks of Cree LED.
CLD-DS268
REV 0
21
THERMAL DESIGN
The CHA family of LED arrays can include over a hundred different LED die inside one package, and thus over a hundred different junction
temperatures (T
J). Cree LED has intentionally removed junction-temperature-based operating limits and replaced the commonplace
maximum T
J calculations with maximum ratings based on forward current (IF) and case temperature (Tc). No additional calculations
are required to ensure the CHA LED is being operated within its designed limits. LES temperature measurement provides additional
verification of good thermal design. Please refer to page 3 for the Operating Limits specification.
There is no need to calculate for T
J inside the package, as the thermal management design process, specifically from solder point (TSP) to
ambient (T
a), remains identical to any other LED component. For more information on thermal management of XLamp LEDs, please refer
to the Thermal Management application note. For CHA soldering recommendations and more information on thermal interface materials
(TIM), LES temperature measurement, and connection methods, please refer to the XLamp CHA Family LEDs soldering and handling
document.
To keep the CHA0612 LED at or below the maximum rated Tc, the case to ambient temperature
thermal resistance (R_c-a) must be at or below the maximum R_c-a value shown on the following
graphs, depending on the operating environment. The y-axis in the graphs is a base 10 logarithmic
scale.
As the figure at right shows, the R_c-a value is the sum of the thermal resistance of the TIM (R_tim)
plus the thermal resistance of the heat sink (R_hs).
R_j-c
Tc
R_tim
R_hs
Ta
R_j-c
Tc
R_c-a
Ta
CHA0612 18V
0.01
0.10
1.00
10.00
100.00
100
200
300
400
500
600
700
800
900
1000
1100
1200
Current (mA)
Ta = 25 °C
Ta = 55 °C
Ta = 85 °C
Ta = 105 °C
18 V



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