www.sensirion.com / D1

Version 1

– December 2022

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The land pattern is recommended to be designed according to the used PCB and soldering process

together with the physical outer dimensions of the sensor. For reference, the land pattern used with

Sensirion’s PCBs and soldering processes is given in Figure 7. Soldering of the central die pad is

optional. Sensirion recommends to not solder the central die pad because the sensor can reach

higher temperatures upon heater activation

6 Quality and Material Contents

Qualification of SHT33-DIS is performed based on the JEDEC JESD47 qualification test method,

qualification report available on request. The device is fully RoHS and WEEE compliant, e.g. free

of Pb, Cd, and Hg.

For general remarks of best practice in processing humidity sensor please refer to the handling

instructions [4].

.

Figure 7. Recommended metal land pattern (left) and stencil apertures (right) for SHT33-DIS. The

dashed lines represent the outer dimension of the DFN package. The PCB pads (left) and stencil

apertures (right) are indicated through the shaded areas.

Recommended Land Pattern

Recommended Stencil Aperture

0.55

1

2.35

0.2

0.9

0.55

2.55

0.3