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PCF8576DH/2 Datasheet(PDF) 31 Page - NXP Semiconductors

Part # PCF8576DH/2
Description  Universal LCD driver for low multiplex rates
PDF  41 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCF8576DH/2 Datasheet(HTML) 31 Page - NXP Semiconductors

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2004 Dec 22
31
Philips Semiconductors
Product specification
Universal LCD driver for low
multiplex rates
PCF8576D
12 BONDING PAD INFORMATION
Table 15 Bonding pad locations
All x/y coordinates represent the position of the centre of
each pad (in
µm) with respect to the centre (x/y = 0) of the
chip (see Fig.23).
Table 16 Gold bump dimension PCF8576DU/2DA/2
SYMBOL
PAD
COORDINATES
xy
SDA
1
−34.38
−876.6
SCL
2
+109.53
−876.6
SCL
3
+181.53
−876.6
SYNC
4
+365.58
−876.6
CLK
5
+469.08
−876.6
VDD
6
+577.08
−876.6
OSC
7
+740.88
−876.6
A0
8
+835.83
−876.6
A1
9
+1005.48
−630.9
A2
10
+1005.48
−513.9
SA0
11
+1005.48
−396.9
VSS
12
+1005.48
−221.4
VLCD
13
1005.48
10.71
BP0
14
1005.48
156.51
BP2
15
1005.48
232.74
BP1
16
1005.48
308.97
BP3
17
1005.48
385.2
S0
18
1005.48
493.2
S1
19
1005.48
565.2
S2
20
1005.48
637.2
S3
21
1005.48
709.2
S4
22
347.22
876.6
S5
23
263.97
876.6
S6
24
180.72
876.6
S7
25
97.47
876.6
S8
26
14.22
876.6
S9
27
−69.03
+876.6
S10
28
−152.28
+876.6
S11
29
−235.53
+876.6
S12
30
−318.78
+876.6
S13
31
−402.03
+876.6
S14
32
−485.28
+876.6
S15
33
−568.53
+876.6
S16
34
−651.78
+876.6
S17
35
−735.03
+876.6
S18
36
−1005.5
+625.59
S19
37
−1005.5
+541.62
S20
38
−1005.5
+458.19
S21
39
−1005.5
+374.76
S22
40
−1005.5
+291.33
S23
41
−1005.5
+207.9
S24
42
−1005.5
+124.47
S25
43
−1005.5
+41.04
S26
44
−1005.5
−42.39
S27
45
−1005.5
−125.8
S28
46
−1005.5
−209.3
S29
47
−1005.5
−292.7
S30
48
−1005.5
−376.1
S31
49
−1005.5
−459.5
S32
50
−1005.5
−543
S33
51
−1005.5
−625.6
S34
52
−735.03
−876.6
S35
53
−663.03
−876.6
S36
54
−591.03
−876.6
S37
55
−519.03
−876.6
S38
56
−447.03
−876.6
S39
57
−375.03
−876.6
SDA
58
−196.38
−876.6
SDA
59
−106.38
−876.6
Alignment marks
C1
+930.42
−870.3
C2
−829.98
−870.3
DESCRIPTION
DIMENSION
Gold bump dimension
52
µm × 80 µm × 15 µm
Gold bump tolerance
3
µm
SYMBOL
PAD
COORDINATES
xy



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