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M95640-R Datasheet(PDF) 48 Page - STMicroelectronics |
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M95640-R Datasheet(HTML) 48 Page - STMicroelectronics |
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48 / 53 page ![]() Package information M95640-W M95640-R M95640-DF 48/53 DocID16877 Rev 19 Figure 28. Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale package recommended footprint 1. Dimensions are expressed in millimeters. G - 0.137 - - 0.0054 - aaa - 0.110 - - 0.0043 - bbb - 0.110 - - 0.0043 - ccc - 0.110 - - 0.0043 - ddd - 0.060 - - 0.0024 - eee - 0.060 - - 0.0024 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 24. Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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