PCF21XXC_FAM

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© NXP Semiconductors N.V. 2015. All rights reserved.

Product data sheet

Rev. 3 — 6 May 2015

17 of 25

NXP Semiconductors

PCF21xxC family

LCD drivers

13. Handling information

All input and output pins meet the requirements of the MIL-STD-883 class 2, method 3015

ElectroStatic Discharge (ESD) test. When handling Metal-Oxide Semiconductor (MOS)

devices ensure that all normal precautions are taken as described in JESD625-A,

IEC 61340-5 or equivalent standards.

14. Packing information

14.1 Tape and reel information

For tape and reel packing information, see Ref. 10 “SOT136-1_118” and Ref. 11

“SOT158-1_118”.

15. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

15.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

15.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation