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ASI4U Datasheet(PDF) 60 Page - Renesas Technology Corp |
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ASI4U Datasheet(HTML) 60 Page - Renesas Technology Corp |
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60 / 71 page ![]() ASI4U / ASI4U-E / ASI4U-F Datasheet © 2016 Integrated Device Technology, Inc. 60 January 26, 2016 Table 4.29 CAP Pin Parameters PARAMETER SYMBOL CONDITIONS MIN Typical MAX UNIT Input voltage range VCAP_IN -0.3 VU5R V External decoupling capacitor CCAP 47 nF Note: In some applications, a resistor connected in series with CCAP might improve the impedance behavior of the internal electronic inductor. Depending of the application, this resistor must be dimensioned in the range of 10 Ω to 100Ω. The decoupling capacitor defines an internal low-pass filter time constant; lower values decrease the impedance but improve the turn-on time. Higher values do not improve the impedance but do increase the turn-on time. The turn-on time also depends on the load capacitor at UOUT. After connecting the slave to the power, the capacitor is charged with the maximum current IUOUT. The impedance will increase when the voltage allows the analog circuitry to fully operate. 4.19. Thermal and Overload Protection The IC continuously observes its silicon die temperature. If the temperature rises above approximately 140°C for more than 2 seconds, the IC will be put into shutdown and stay there until the next power-on reset occurs. The circuit is also shut down if UOUT pin is overloaded (e.g., shorted to GND) for more than 2 seconds. Table 4.30 Shutdown Temperature PARAMETER SYMBOL CONDITIONS MIN MAX UNIT Chip temperature for over-temperature shut down TShut 125 160 °C 5 Application Circuits The following figures show typical application cases for the ASI4U. Note that these schematics show only basic circuit principles. For more detailed application information, see the ASI4U Application Note – Evaluation Board. Figure 5.1 outlines a standard slave application circuit. Figure 5.2 shows an extended power application circuit with an externally decoupled sensor supply. A Master/Repeater Mode application is shown in Figure 5.3. |
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