2

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

2.1

Bumpless CSP package information

Figure 9. Bumpless CSP package outline

SIDE VIEW

Coating 25µm

BOTTOM VIEW (pads up)

OUT

GND3

GND4

GND2

IN

GND1

X

A1

A1

a

A

Table 4. Bumpless CSP package mechanical data

Parameter

Description

Min.

Typ.

Max.

Unit

X

X dimension of the die

975

1000

1025

µm

Y

Y dimension of the die

1575

1600

1625

µm

A

X pitch

500

µm

B

Y pitch

587

µm

A1

Distance from bump to edge of die on X axis

250

µm

B1

Distance from pad to edge of die on Y axis

213

µm

a

Pad dimension

200

µm

T

Substrate thickness

375

400

425

µm

MLPF-WB55-01E3

Package information

DS12804 - Rev 3

page 5/13