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STM32WB30CX Datasheet(PDF) 6 Page - STMicroelectronics |
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STM32WB30CX Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 13 page ![]() Figure 10. Marking Figure 11. Top view Top view (pads down) OUT GND3 GND4 GND2 IN GND1 More packing information is available in the application note: • AN2348 Flip-Chip: “Package description and recommendations for use Figure 12. Tape and reel outline Ø D0 P0 User direction of unreeling Note: Pocket dimensions are not on scale Pocket shape may vary depending on package Ø D1 F P2 P1 K0 W Pin 1 located according to EIA-481 A0 B0 0.03 RAISED CROSS-BAR MLPF-WB55-01E3 Bumpless CSP package information DS12804 - Rev 3 page 6/13 |
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