HCTS139MS

Rev X.00

Page 9 of 9

Jan 13, 2017

Die Characteristics

DIE DIMENSIONS:



2.74mm x 2.68mm



108 mils x 106 mils

METALLIZATION:



Type: SiAl



Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:



Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:



<2.0 x 105A/cm2

BOND PAD SIZE:



100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCTS139MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCTS139 is TA14409.

E1 1

(1)

A0 1

(2)

A1 1 (3)

Y0 1 (4)

Y1 1 (5)

Y2 2 (6)

(7)

(8)

GND

(9)

2 Y3

(10) 2 Y2

(11) 2 Y1

(12) 2 Y0

(13) 2 A1

VCC

E 2

(14) 2 A0

Y3 1

(15)

(16)