6.4 Thermal Information - TLV3012-Q1 DCK Package Only

THERMAL METRIC(1)

TLV3012-Q1

UNIT

DCK (SOT)

6 PINS

RθJA

Junction-to-ambient thermal resistance

179.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

141.3

°C/W

RθJB

Junction-to-board thermal resistance

71.2

°C/W

ψJT

Junction-to-top characterization parameter

53.6

°C/W

ψJB

Junction-to-board characterization parameter

71.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information- TLV301x-Q1 DBV Package, TLV3011B-Q1 and TLV3012B-Q1

THERMAL METRIC(1)

TLV3011B-Q1, TLV3012B-Q1

UNIT

DCK

(SC-70)

DBV

(SOT-23)

6 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

169.8

162.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

120.5

78.8

°C/W

RθJB

Junction-to-board thermal resistance

63.2

42.1

°C/W

ψJT

Junction-to-top characterization parameter

45.9

21.2

°C/W

ψJB

Junction-to-board characterization parameter

63.0

41.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

-

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

6.6 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

1.8

5.5

V

Supply voltage: VS = (V+) – (V–)

B-Versions

1.65

5.5

V

Input voltage range from (V–)

–0.2

(V+) + 0.2

V

Output voltage range from (V–) for open drain

–0.2

(V+)

V

Output voltage range from (V–) for open drain

B-Versions

–0.2

5.5

V

Ambient temperature, TA

–40

125

°C

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TLV3011-Q1, TLV3012-Q1, TLV3011B-Q1, TLV3012B-Q1

SBOS551C – MARCH 2011 – REVISED APRIL 2023

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