Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings TLV3012-Q1 DCK

Package Only ............................................................... 4

6.2 Absolute Maximum Ratings - TLV301x-Q1 DBV

Package, TLV3011B-Q1 and TLV3012B-Q1 ................ 4

6.3 ESD Ratings............................................................... 4

6.4 Thermal Information - TLV3012-Q1 DCK

Package Only................................................................ 5

6.5 Thermal Information- TLV301x-Q1 DBV

Package, TLV3011B-Q1 and TLV3012B-Q1 ................ 5

6.6 Recommended Operating Conditions.........................5

6.7 Electrical Characteristics - TLV3012-Q1 DCK

Package Only ............................................................... 6

6.8 Switching Characteristics - TLV3012-Q1 DCK

Package Only ............................................................... 7

6.9 Electrical Characteristics- TLV301x-Q1 DBV

Package, TLV3011B-Q1 and TLV3012B-Q1 ................ 8

6.10 Switching Characteristics- TLV301x-Q1 DBV

Package, TLV3011B-Q1 and TLV3012B-Q1 .............. 10

7 Typical Characteristics - TLV3012-Q1 DCK

Package Only ................................................................11

8 Typical Characteristics - TLV301x-Q1 DBV

Package, TLV3011B-Q1 and TLV3012B-Q1 ................ 15

9 Detailed Description......................................................21

9.1 Overview................................................................... 21

9.2 Functional Block Diagram......................................... 21

9.3 Feature Description...................................................21

9.4 Device Functional Modes..........................................21

10 Application and Implementation................................ 23

10.1 Application Information........................................... 23

10.2 Typical Application.................................................. 24

10.3 System Examples................................................... 26

10.4 Power Supply Recommendations...........................27

10.5 Layout..................................................................... 28

11 Device and Documentation Support..........................29

11.1 Receiving Notification of Documentation Updates.. 29

11.2 Support Resources................................................. 29

11.3 Trademarks............................................................. 29

11.4 Electrostatic Discharge Caution.............................. 29

11.5 Glossary.................................................................. 29

12 Mechanical, Packaging, and Orderable

Information.................................................................... 29

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (August 2022) to Revision C (April 2023)

Page

• Added TLV3011B-Q1 and TLV3012B-Q1 to front page text and tables............................................................. 1

Changes from Revision A (June 2019) to Revision B (August 2022)

Page

• Added TLV3011-Q1 in both DBV and DCK Packages....................................................................................... 1

• Added TLV3012-Q1 in SOT-23 (DBV)................................................................................................................1

• Added new tables for DBV packages.................................................................................................................1

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

Changes from Revision * (March 2011) to Revision A (June 2019)

Page

• Added the HBM and CDM ESD ratings and classification levels. Also added the AEC-Q100 device

temperature grade ............................................................................................................................................. 1

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section................................................................................................................................................................ 1

• Deleted the TLV3011-Q1 device from the data sheet and removed A from the TLV3012-Q1 part number ...... 1

• Deleted the Package Ordering Information section............................................................................................ 3

• Moved the switching characteristics from the Electrical Characteristics table to the Switching Characteristics

table.................................................................................................................................................................... 7

TLV3011-Q1, TLV3012-Q1, TLV3011B-Q1, TLV3012B-Q1

SBOS551C – MARCH 2011 – REVISED APRIL 2023

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