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STM32H7 Datasheet(PDF) 326 Page - STMicroelectronics

Part # STM32H7
Description  32-bit Arm® Cortex®-M7 480MHz MCUs, up to 2MB flash, up to 1MB RAM, 46 com. and analog interfaces
PDF  357 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H7 Datasheet(HTML) 326 Page - STMicroelectronics

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Package information
STM32H742xI/G STM32H743xI/G
326/357
DS12110 Rev 10
Notes:
1.
Dimensioning and tolerancing schemes conform to ASME Y14.5M-2018.
2.
TFBGA stands for thin profile fine pitch ball grid array: 1.00 mm < A ≤ 1.20 mm / fine
pitch e < 1.00 mm.
3.
The profile height, A, is the distance from the seating plane to the highest point on the
package. It is measured perpendicular to the seating plane.
4.
A1 is defined as the distance from the seating plane to the lowest point on the package
body.
5.
Dimension b is measured at the maximum diameter of the terminal (ball) in a plane
parallel to primary datum C.
6.
BSC stands for BASIC dimensions. It corresponds to the nominal value and has no
tolerance. For tolerances refer to form and position table. On the drawing these
dimensions are framed.
7.
Primary datum C is defined by the plane established by the contact points of three or
more solder balls that support the device when it is placed on top of a planar surface.
8.
The terminal (ball) A1 corner must be identified on the top surface of the package by
using a corner chamfer, ink or metalized markings, or other feature of package body or
Table 219. TFBGA100 - Mechanical data
Symbol
millimeters(1)
inches(12)
Min
Typ
Max
Min
Typ
Max
A(2)(3)
-
-
1.20
-
-
0.0472
A1(4)
0.15
-
-
0.0059
-
-
A2
-
0.74
-
-
0.0291
-
b(5)
0.35
0.40
0.45
0.0138
0.0157
0.0177
D8.00 BSC(6)
0.3150 BSC
D1
7.20 BSC
0.2835 BSC
E
8.00 BSC
0.3150 BSC
E1
7.20 BSC
0.2835 BSC
e(9)
0.80 BSC
0.0315 BSC
N(11)
100
SD(12)
0.40 BSC
0.0157
SE(12)
0.40 BSC
0.0157
aaa
0.15
0.0059
ccc
0.20
0.0079
ddd
0.10
0.0039
eee
0.15
0.0059
fff
0.08
0.0031



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