STM32H7 datasheet(327/357 Pages) STMICROELECTRONICS

Part #	STM32H7

Description	32-bit Arm® Cortex®-M7 480MHz MCUs, up to 2MB flash, up to 1MB RAM, 46 com. and analog interfaces

PDF	357 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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327 / 357 page

DS12110 Rev 10

327/357

STM32H742xI/G STM32H743xI/G

Package information

348

integral heat slug. A distinguish feature is allowable on the bottom surface of the

package to identify the terminal A1 corner. Exact shape of each corner is optional.

e represents the solder ball grid pitch.

10. N represents the total number of balls on the BGA.

11. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the

position of the centre ball(s) in the outer row or column of a fully populated matrix.

12. Values in inches are converted from mm and rounded to 4 decimal digits.

13. Drawing is not to scale.

Figure 123. TFBGA100 - Footprint example

Table 220. TFBGA100 - Example of PCB design rules (0.8 mm pitch BGA)

Dimension

Values

Pitch

0.8

Dpad

0.400 mm

Dsm

0.470 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.400 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.120 mm

BGA_WLCSP_FT_V1

Dsm

Dpad

STM32H7 Datasheet(PDF) 327 Page - STMicroelectronics