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STM32L151CBT7ADTR Datasheet(PDF) 115 Page - STMicroelectronics |
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STM32L151CBT7ADTR Datasheet(HTML) 115 Page - STMicroelectronics |
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115 / 130 page  DocID024330 Rev 5 115/130 STM32L151x6/8/B-A STM32L152x6/8/B-A Package information 129 and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. 7.4 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package information Figure 39. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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