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ADC08B3000 Datasheet(PDF) 29 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # ADC08B3000
Description  High Performance, Low Power, 8-Bit, 3 GSPS A/D Converter with 4K Buffer
PDF  32 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

ADC08B3000 Datasheet(HTML) 29 Page - National Semiconductor (TI)

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2.0 Applications Information
(Continued)
2.4.4 Power Down Feature
The Power Down pin (PD) allow the ADC08B3000 to be
entirely powered down (PD). See Section 1.1.7 for details on
the power down feature.
The digital data output pins are put into a high impedance
state when the PD pin for the respective channel is high.
Upon return to normal operation, the pipeline will contain
meaningless information and must be flushed.
If the PD input is brought high while a calibration is running,
the device will not go into power down until the calibration
sequence is complete. However, if power is applied and PD
is already high, the device will not begin the calibration
sequence until the PD input goes low. If a manual calibration
is requested while the device is powered down, the calibra-
tion will not begin at all. That is, the manual calibration input
is completely ignored in the power down state.
2.5 THE DIGITAL OUTPUTS
The output format is CMOS and Offset Binary. Accordingly, a
full-scale input level with V
IN+ positive with respect to VIN−
will produce an output code of all ones, a full-scale input
level with V
IN− positive with respect to VIN+ will produce an
output code of all zeros and when V
IN+ and VIN− are equal,
the output code will vary between codes 127 and 128.
2.6 POWER CONSIDERATIONS
A/D converters draw sufficient transient current to corrupt
their own power supplies if not adequately bypassed. A 33
µF capacitor should be placed within an inch (2.5 cm) of the
A/D converter power pins. A 0.1 µF capacitor should be
placed as close as possible to each V
A pin, preferably within
one-half centimeter. Leadless chip capacitors are preferred
because they have low lead inductance.
The V
A and VDR supply pins should be isolated from each
other to prevent any digital noise from being coupled into the
analog portions of the ADC. A ferrite choke, such as the JW
Miller FB20009-3B, is recommended between these supply
lines when a common source is used for them.
As is the case with all high speed converters, the
ADC08B3000 should be assumed to have little power supply
noise rejection. Any power supply used for digital circuitry in
a system where a lot of digital power is being consumed
should not be used to supply power to the ADC08B3000.
The ADC supplies should be the same supply used for other
analog circuitry, if not a dedicated supply.
2.6.1 Supply Voltage
The ADC08B3000 is specified to operate with a supply volt-
age of 1.9V ±0.1V. It is very important to note that, while this
device will function with slightly higher supply voltages,
these higher supply voltages may reduce product lifetime.
No pin should ever have a voltage on it that is in excess of
the supply voltage or below ground by more than 150 mV,
not even on a transient basis. This can be a problem upon
application of power and power shut-down. Be sure that the
supplies to circuits driving any of the input pins, analog or
digital, do not come up any faster than does the voltage at
the ADC08B3000 power pins.
The Absolute Maximum Ratings should be strictly observed,
even during power up and power down. A power supply that
produces a voltage spike at turn-on and/or turn-off of power
can destroy the ADC08B3000. The circuit of Figure 12 will
provide supply overshoot protection.
Many linear regulators will produce output spiking at
power-on unless there is a minimum load provided. Active
devices draw very little current until their supply voltages
reach a few hundred millivolts. The result can be a turn-on
spike that can destroy the ADC08B3000, unless a minimum
load is provided for the supply. The 100
Ω resistor at the
regulator output provides a minimum output current during
power-up to ensure there is no turn-on spiking.
In the circuit of Figure 12, an LM317 linear regulator is
satisfactory if its input supply voltage is 4V to 5V . If a 3.3V
supply is used, an LM1086 linear regulator is recommended.
The output drivers should have a supply voltage, V
DR, that is
within the range specified in the Operating Ratings table.
This voltage should not exceed the V
A supply voltage.
If the power is applied to the device without an input clock
signal present, the current drawn by the device might be
below 200 mA. This is because the ADC08B3000 gets reset
through clocked logic and its initial state is unknown. If the
reset logic comes up in the "on" state, it will cause most of
the analog circuitry to be powered down, resulting in less
than 100 mA of current draw. This current is greater than the
power down current because not all of the ADC is powered
down. The device current will be normal after the input clock
is established.
2.6.2 Thermal Management
The ADC08B3000 is capable of impressive speeds and
performance at very low power levels for its speed. However,
the power consumption is still high enough to require atten-
tion to thermal management. For reliability reasons, the die
temperature should be kept to a maximum of 130˚C. That is,
T
A (ambient temperature) plus ADC power consumption
times
θ
JA (junction to ambient thermal resistance) should not
exceed 130˚C. This is not a problem if the ambient tempera-
ture is kept to a maximum of +85˚C as specified in the
Operating Ratings section.
Please note that the following are general recommendations
for mounting exposed pad devices onto a PCB. This should
be considered the starting point in PCB and assembly pro-
cess development. It is recommended that the process be
developed based upon past experience in package mount-
ing.
The package of the ADC08B3000 has an exposed pad on its
back that provides the primary heat removal path as well as
excellent electrical grounding to the printed circuit board.
The land pattern design for lead attachment to the PCB
should be the same as for a conventional LQFP, but the
exposed pad must be attached to the board to remove the
maximum amount of heat from the package, as well as to
ensure best product parametric performance.
20160154
FIGURE 12. Non-Spiking Power Supply
www.national.com
29



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