S32K311NHT0MPAST datasheet(3/146 Pages) NXP

3 / 146 page

Contents

Overview............................................................ 5

Block diagram.....................................................5

Feature comparison......................................... 12

Ordering information.........................................17

4.1

Determining valid orderable parts ................ 17

General.............................................................17

5.1

Absolute maximum ratings............................18

5.2

Voltage and current operating requirements.19

5.3

Thermal operating characteristics.................21

5.4

ESD and Latch-up Protection Characteristics

...................................................................... 22

Power management......................................... 22

6.1

Power management system - S32K344,

S32K324, S32K341, S32K314, S32K342, and

S32K322....................................................... 23

6.2

Power management system - S32K312,

S32K311, S32K310...................................... 24

6.3

Power management system - S32K358,

S32K348, S32K338, S32K328......................25

6.4

Power management system - S32K388....... 26

6.5

Power mode transition operating behaviors..26

6.5.1

Power mode transition operating behavior... 26

6.5.2

Boot time, HSE firmware not installed.......... 27

6.5.3

Boot time, HSE firmware installed................ 27

6.5.4

HSE firmware memory verification time

examples.......................................................28

6.6

Supply Monitoring......................................... 32

6.7

Recommended Decoupling Capacitors........ 34

6.8

V15 regulator (SMPS option) electrical

specifications................................................ 46

6.9

V15 regulator (BJT option, NPN ballast

transistor control) electrical specifications.... 47

6.10

V11 regulator (NMOS ballast transistor control)

electrical specifications................................. 48

6.11

Supply currents............................................. 49

6.12

Operating mode............................................ 68

6.13

Cyclic wake-up current .................................70

I/O parameters................................................. 70

7.1

GPIO DC electrical specifications, 3.3V Range

(2.97V - 3.63V)..............................................70

7.2

GPIO DC electrical specifications, 5.0V (4.5V -

5.5V)............................................................. 74

7.3

5.0V (4.5V - 5.5V) GPIO Output AC

Specification..................................................78

7.4

3.3V (2.97V - 3.63V) GPIO Output AC

Specification..................................................79

Glitch Filter....................................................... 80

Flash memory specification..............................81

9.1

Flash memory program and erase

specifications................................................ 81

9.2

Flash memory Array Integrity and Margin Read

specifications................................................ 82

9.3

Flash memory module life specifications...... 83

9.3.1

Data retention vs program/erase cycles....... 83

9.4

Flash memory AC timing specifications........ 84

9.5

Flash memory read timing parameters......... 84

Analog modules................................................85

10.1

SAR ADC...................................................... 85

10.2

Supply Diagnosis.......................................... 88

10.3

Low Power Comparator (LPCMP)................ 88

10.4

Temperature Sensor..................................... 92

Clocking modules............................................. 92

11.1

FIRC..............................................................92

11.2

SIRC............................................................. 93

11.3

PLL................................................................93

11.4

Fast External Oscillator (FXOSC)................. 94

11.5

Slow Crystal Oscillator (SXOSC).................. 97

Communication interfaces................................97

12.1

LPSPI............................................................97

12.2

LPSPI0 20 MHz and 15 MHz Combinations102

12.3

Communication between two S32K388

devices........................................................102

12.3.1

Timing specification for S32K388 to S32K388

communication............................................104

12.4

I2C...............................................................104

12.5

FlexCAN characteristics..............................104

12.6

SAI electrical specifications........................ 104

12.6.1

SAI Electrical Characteristics, Slave Mode.105

12.6.2

SAI Electrical Characteristics, Master Mode106

12.7

Ethernet characteristics.............................. 107

12.7.1

Ethernet MII (100 Mbps)............................. 107

12.7.2

Ethernet MII (200 Mbps)............................. 109

12.7.3

Ethernet RMII..............................................111

12.7.4

Ethernet RGMII........................................... 113

12.7.5

MDIO timing specifications......................... 114

12.8

QuadSPI..................................................... 115

12.8.1

QuadSPI Quad 3.3V SDR 120MHz............ 115

12.8.2

QuadSPI Octal 3.3V DDR 100MHz............ 117

12.8.3

QuadSPI Quad 3.3V SDR 103.33MHz....... 118

12.8.4

QuadSPI Octal 3.3V DDR 120MHz............ 119

12.8.5

QuadSPI Quad 3.3V SDR 125MHz............ 120

12.9

uSDHC........................................................121

12.9.1

uSDHC SDR electrical specifications......... 121

12.9.2

uSDHC DDR electrical specifications......... 122

12.10

LPUART specifications............................... 123

Debug modules.............................................. 123

13.1

Debug trace timing specifications............... 124

13.2

SWD electrical specifications......................124

13.3

JTAG electrical specifications..................... 126

Thermal Attributes.......................................... 128

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