UPD64A datasheet(57/66 Pages) RENESAS

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µPD64A, 65

Data Sheet U14380EJ3V0DS00

15. RECOMMENDED SOLDERING CONDITIONS

The

µPD64A and 65 should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales representa-

tive.

Table 15-1. Surface Mounting Type Soldering Conditions

µPD64AMC-×××-5A4: 20-pin plastic SSOP (7.62 mm (300))

µPD65MC-×××-5A4:

20-pin plastic SSOP (7.62 mm (300))

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C, time: 30 seconds max. (210°C or higher),

IR35-00-3

count: three times or less

VPS

Package peak temperature: 215

°C, time: 40 seconds max. (200°C or higher),

VP15-00-3

count: three times or less

Wave soldering

Solder bath temperature: 260

°C max., time: 10 seconds max, count: once,

WS60-00-1

Preheating temperature: 120

°C max. (package surface temperature)

Partial heating

Pin temperature: 300

°C max., time: 3 seconds max. (per pin row)

—

Caution Do not use different soldering methods together (except for partial heating).

UPD64A Datasheet(PDF) 57 Page - Renesas Technology Corp