12

µPD16331

RECOMMENDED SOLDERING CONDITIONS

Please perform the soldered mounting of this product under the following recommended conditions.

For soldering methods and conditions other than those recommended here, please contact your NEC sales represen-

tative.

Surface Mount Type

For details on recommended soldering conditions, please refer to the “Semiconductor Device Mounting Technol-

ogy Manual” (C10535E).

µPD16306AGF-3BA

Soldering Method

Soldering Conditions

Recommended Conditions

Symbol

Infrared Reflow

Package peak temperature: 235

°C, time: up to 30 sec.

IR-35-207-2

(no less than 210

°C), count: twice, restricted number of days: less than

7 daysNote

VPS

Package peak temperature: 215

°C, time: up to 40 sec.

VP15-207-1

(no less than 200

°C), count: once, restricted number of days:

less than 7 daysNote

Pin Part Heating

Pin part temperature: no more than 300

°C, time: up to 10 sec.,

restricted number of days: noneNote

Note This refers to the restricted number of days for storage after decapsulating the dry pack. The storage conditions

are no more than 25

°C and 65 % RH.

Caution

Please avoid mixing use of soldering methods (except for pin part heating methods).

References

NEC Semiconductor Device Reliability/Quality Control System (IEI-1212)

Quality Grades of NEC Semiconductor Devices (C11531E)

Semiconductor Device Mounting Technology Manual (C10535E)