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IMX8XLB0IEC Datasheet(PDF) 40 Page - NXP Semiconductors

Part # IMX8XLB0IEC
Description  i.MX 8XLite Industrial Applications Processors
PDF  112 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMX8XLB0IEC Datasheet(HTML) 40 Page - NXP Semiconductors

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1. As programmed in the associated IOMUX (PDRV field) register.
3.7.1.2 Single-voltage 1.8 V GPIO output buffer drive strength
The following table shows the GPIO output buffer drive strength (OVDD 1.8 V).
Table 31. Single-voltage GPIO 1.8 V output impedance DC parameters
Parameter
Symbol
Test conditions
Typical
Units
Output impedance
ZO
1 DSE=000
200
Ω
1 DSE=001
100
1 DSE=010
55
1 DSE=011
40
1 DSE=100
30
1 DSE=101
24
1 DSE=110
20
1 DSE=111
18
1. As programmed in the associated IOMUX (DSE field) register.
3.7.1.3 Single-voltage 3.3 V GPIO output buffer drive strength
The following table shows the GPIO output buffer drive strength (OVDD 3.3 V).
Table 32. Single-voltage GPIO 3.3 V output impedance DC parameters
Parameter
Symbol
Test conditions
Typical
Units
Output impedance
ZO
1 DSE=00
400
Ω
1 DSE=01
200
1 DSE=10
100
1 DSE=11
50
1. As programmed in the associated IOMUX (DSE field) register.
3.7.2 DDR I/O output buffer impedance
The following tables show DDR3L and LPDDR4 I/O output buffer impedance of the
device.
The ZQ Calibration cell uses a single register (ZQnPR0) to determine the target output
buffer impedances of the pull-up driver and the pull-down driver, as well as the target
on-die termination impedance. The resulting calibration setting is then applied to all
DDR pads within the PHY complex.
Electrical characteristics
40
i.MX 8XLite Industrial Applications Processors, Rev. 3, 08/2023
NXP Semiconductors



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