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HT1MOA3S30/E/3 Datasheet(PDF) 22 Page - NXP Semiconductors

Part # HT1MOA3S30/E/3
Description  HITAGTM1 Chip Module
PDF  24 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

HT1MOA3S30/E/3 Datasheet(HTML) 22 Page - NXP Semiconductors

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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Ht1moa3.doc /HS
Page 22 of 24
Definitions
Data sheet status
Objective specification
This data sheet conta ins ta rget o r goal spec ifications for product deve lopment.
Preliminary specification This data sheet conta ins p reliminary data; supp lementa ry data may be
pub lished later.
Product spec ificat ion
This data sheet conta ins final product spec ificat ions.
Limiting values
Limiting va lues g iven a re in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134).
Stress above one o r more of the limiting va lues may cause pe rmanent da mage to the dev ice.
These a re st ress ratings on ly and ope ration of the dev ice at these o r at any othe r cond itions
above those g iven in the Characte rist ics sect ion of the spec ificat ion is not implied. Exposu re to
limiting va lues for extended pe riods may aff ect dev ice reliab
ility.
Application information
Where app licat ion information is g iven, it is adv iso ry and does not form part of the spec ificat ion.
Life support applications
These products are not designed for use in life support appliances, devices, or systems where
malfunction of these products can reasonably be expected to result in personal injury. Philips
Semiconductors´ customers using or selling these products for use in such applications do so on
their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from
such improper use or sale.



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