13

AT24C01B [Preliminary]

5156B–SEEPR–5/06

Notes:

1. “-B” denotes bulk.

2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT 23 and dBGA2 = 5K per reel.

3.Available in waffle pack, tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon

request. Please contact Serial EEPROM Marketing.

AT24C01B Ordering Information

Ordering Code

Package

Operation Range

AT24C01B-PU (Bulk form only)

8P3

8S1

8S1

8A2

8A2

8Y6

5TS1

8U3-1

Lead-free/Halogen-free/

Industrial Temperature

(–40

°C to 85°C)

Die Sale

Industrial Temperature

(–40

°C to 85°C)

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8Y6

8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)

5TS1

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8U3-1

8-ball, die Ball Grid Away Package (dBGA2)

Options

–1.8

Low-voltage (1.8V to 5.5V)