SPEC NO: DSAI6703

REV NO: V.1

DATE: AUG/26/2008

PAGE: 4 OF 12

APPROVED: WYNEC

CHECKED: Allen Liu

DRAWN: S.P.Chen

ERP: 1212000022

3.2x2.8mm SMD LED WITH CERAMIC

SUBSTRATE

JEDEC Moisture Sensitivity:

Floor Life

Soak Requirements

Standard

Accelerated Equivalent1

Time

Conditions

Time (hours)

Conditions

Time (hours)

Conditions

1

Unlimited

≤ 30 °C / 85% RH

168

+ 5 / - 0

85 °C / 85% RH

2

1 year

≤ 30 °C / 60% RH

168

+ 5 / - 0

85 °C / 60% RH

2a

4 weeks

≤ 30 °C / 60% RH

6962

+ 5 / - 0

30 °C / 60% RH

120

+ 1 / - 0

60 °C / 60% RH

3

168 hours

≤ 30 °C / 60% RH

1922

+ 5 / - 0

30 °C / 60% RH

40

+ 1 / - 0

60 °C / 60% RH

4

72 hours

≤ 30 °C / 60% RH

962

+ 2 / - 0

30 °C / 60% RH

20

+ 0.5 / - 0

60 °C / 60% RH

5

48 hours

≤ 30 °C / 60% RH

722

+ 2 / - 0

30 °C / 60% RH

15

+ 0.5 / - 0

60 °C / 60% RH

5a

24 hours

≤ 30 °C / 60% RH

482

+ 2 / - 0

30 °C / 60% RH

10

+ 0.5 / - 0

60 °C / 60% RH

6

Time on Label (TOL)

≤ 30 °C / 60% RH

TOL

30 °C / 60% RH

Level

Level

Floor Life

Soak Requirements

Standard

Accelerated Equivalent

Time

Conditions

Time (hours)

Conditions

Time (hours)

Conditions

2a

4 weeks

≤ 30 °C / 60% RH

6962

+ 5 / - 0

30 °C / 60% RH

120

+ 1 / - 0

60 °C / 60% RH

Moisture Sensitivity Levels

Notes:

1.CAUTION - The ‘‘accelerated equivalent’’ soak requirements shall not be used until correlation of damage response, including electrical, after

soak and reflow is established with the ‘‘standard’’ soak requirements or if the known activation energy for diffusion is 0.4 - 0.48 eV. Accelerated

soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides a method for

determining the diffusion coefficient.

2.The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and

includes the maximum time allowed out of the bag at the distributor’s facility.

If the actual MET is less than 24 hours the soak time may be reduced. For soak conditions of 30 °C/60% RH the soak time is reduced by one hour

For each hour the MET is less than 24 hours. For soak conditions of 60 °C/60% RH, the soak time is reduced by one hour for each five hours the

MET is less than 24 hours.

If the actual MET is greater than 24 hours the soak time must be increased. If soak conditions are 30 °C/60% RH, the soak time is increased one

Hour for each hour that the actual MET exceeds 24 hours. If soak conditions are 60 °C/60% RH, the soak time is increased one hour for each five

Hours that the actual MET exceeds 24 hours.

3.Supplier may extend the soak times at their own risk.

ESD Protection During Production

Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors.

The following procedures may decrease the possibility of ESD damage:

1.Minimize friction between the product and surroundings to avoid static buildup.

2.All production machinery and test instruments must be electrically grounded.

3.Operators must wear anti-static bracelets.

4.Wear anti-static suit when entering work areas with conductive machinery.

5.Set up ESD protection areas using grounded metal plating for component handling.

6.All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less.

7.Maintain a humidity level of 50% or higher in production areas.

8.Use anti-static packaging for transport and storage.

9.All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality.