BAS16J_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 8 March 2007

3 of 10

NXP Semiconductors

BAS16J

Single high-speed switching diode

5.

Limiting values

[1]

[2]

[3]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for

[4]

Reflow soldering is the only recommended soldering method.

6.

Thermal characteristics

[1]

[2]

Reflow soldering is the only recommended soldering method.

[3]

Soldering point of cathode tab.

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

repetitive peak reverse

voltage

-

100

V

reverse voltage

-

100

V

forward current

[1] -

250

mA

repetitive peak forward

current

δ≤ 0.25

-

500

mA

non-repetitive peak forward

current

square wave

[2]

-

3.3

A

-

2

A

-

1.5

A

total power dissipation

[3][4] -

550

mW

junction temperature

-

150

°C

ambient temperature

−65

+150

°C

storage temperature

−65

+150

°C

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1][2] -

-

230

K/W

thermal resistance from

junction to solder point

[3] -

-

55

K/W