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ADN4604ASVZ Datasheet(PDF) 37 Page - Analog Devices |
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ADN4604ASVZ Datasheet(HTML) 37 Page - Analog Devices |
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37 / 40 page  Data Sheet ADN4604 Rev. A | Page 37 of 40 Large voids in the thermal paddle area should be avoided. To control voids in the thermal paddle area, solder masking may be required for thermal vias to prevent solder wicking inside the via during reflow, thus displacing the solder away from the interface between the package thermal paddle and thermal paddle land on the PCB. There are several methods employed for this purpose, such as via tenting (top or bottom side), using dry film solder mask; via plugging with liquid photo-imagible (LPI) solder mask from the bottom side; or via encroaching. These options are depicted in Figure 58. In case of via tenting, the solder mask diameter should be 100 microns larger than the via diameter. (A) (B) (D) (C) VIA SOLDER MASK COPPER PLATING Figure 58. Solder Mask Options for Thermal Vias: (A) Via Tenting from the Top; (B) Via Tenting from the Bottom; (C) Via Plugging, Bottom; and (D) Via Encroaching, Bottom |
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