MCP9805T-BESLASHST datasheet(2/34 Pages) MICROCHIP

2 / 34 page

MCP9805

DS21977B-page 2

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

VDD....................................................................... 6.0V

Voltage at all Input/Output pins .... GND – 0.3V to 5.5V

Storage temperature ..........................-65°C to +150°C

Ambient temp. with power applied .....-40°C to +125°C

Junction Temperature (TJ)................................ +150°C

ESD protection on all pins (HBM:MM)....... (4 kV:200V)

Latch-Up Current at each pin ........................ ±200 mA

†Notice: Stresses above those listed under “Maximum

ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground and TA = -20°C to +125°C.

Parameters

Sym

Min

Typ

Max

Unit

Conditions

Power Supply

Operating Voltage Range

VDD

3.0

—

3.6

Operating Current

IDD

—

200

500

µA

Continuous Operation

Shutdown Current

ISHDN

—

0.1

µA

Shutdown Mode

Power-On Reset Threshold (POR)

VPOR

—2.2

—

VDD Falling Edge

Power Supply Rejection

PSRDC

—±0.3

—

°C

PSRAC

—

±0.5

—

°C

VDD = 3.3V + 150 mVpp

(0 to 1 MHz), TA = +25°C

Temperature Sensor Accuracy

Accuracy with 0.25 °C/LSb Resolution:

+75°C to +95°C

TACY

-1.0

±0.5

+1.0

°C

Active Temp. Range

+40°C to +125°C

TACY

-2.0

±1.0

+2.0

°C

Monitor Temp. Range

-20°C to +125°C

TACY

-3.0

±2.0

+3.0

°C

TA = -40°C

TACY

—±2

—

°C

Internal

ΔΣ ADC

Conversion Time (10-bits + Sign):

0.25 °C/LSb

tCONV

—

125

17 samples/sec. (typ.)

Event Output (Open-Drain)

High-Level Current (leakage)

IOH

——

µA

VOH = 3.6V

Low-Level Voltage

VOL

——

0.4

IOL= 3 mA

Thermal Response

Response Time (Note):

DFN

tRES

—

0.7

—

Time to 63% of +22°C (Air)

to +125°C (Oil Bath)

TSSOP

tRES

—1.5

—

Note:

Thermal response with 1x1 inch dual-sided copper clad.

MCP9805T-BE/ST Datasheet(PDF) 2 Page - Microchip Technology

MCP9805T-BE/ST Datasheet(HTML) 2 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

Datasheet Download

Link URL