© 2006 Microchip Technology Inc.

DS22005A-page 19

MCP73833/4

10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated

E2

D

A1

A

A3

TOP VIEW

EXPOSED

METAL

PAD

BOTTOM VIEW

21

ID INDEX

PIN 1

E

L

D2

p

b

n

AREA

(NOTE 1)

TIE BAR

(NOTE 3)

EXPOSED

(NOTE 2)

K

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

INCHES

NOM

.020 BSC

.008 REF.

3. Package may have one or more exposed tie bars at ends.

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

JEDEC equivalent: Not Registered

See ASME Y14.5M

See ASME Y14.5M

* Controlling Parameter

Revised 09-12-05

Standoff

Number of Pins

Overall Height

Contact Length §

Lead Width

Exposed Pad Width

Exposed Pad Length

Overall Width

Lead Thickness

Overall Length

Notes:

Pitch

Dimension Limits

(Note 3)

(Note 3)

L

D2

b

E

E2

D

A1

A3

.051

.012

.008

.000

.112

.082

.112

MIN

Units

e

A

n

.031

.065

.016

.010

.001

.118

.094

.118

.067

.020

.015

.002

.124

.096

.124

MAX

.035

10

.039

0.20 REF.

0.30

0.18

1.30

0.00

2.08

2.85

2.85

0.40

0.25

1.65

0.02

3.00

3.00

2.39

0.50 BSC

MILLIMETERS*

0.80

MIN

10

0.90

NOM

0.50

0.30

1.70

0.05

2.45

3.15

3.15

1.00

MAX

2. Exposed pad varies according to die attach paddle size.

Contact-to-Exposed Pad §

K

.008

—

—

0.20

—

—

§ Significant Characteristic

Drawing No. C04-063

Note:

For the most current package drawings, please

see the Microchip Packaging Specification located

at http://www.microchip.com/packaging