DS32kHz

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RELATED APPLICATION NOTES

(Go to www.maxim-ic.com/RTCapps to find these application notes and more.)

Application Note 58: Crystal Considerations with Dallas Real-Time Clocks

Application Note 701: Using the DS32kHz with Dallas RTCs

HANDLING, PC BOARD LAYOUT, AND ASSEMBLY

These packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions

should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent

damage to the crystal.

Avoid running signal traces under the package, unless a ground plane is placed between the package and the

signal line. All N.C. (no connect) pins must be connected to ground.

The BGA package may be reflowed as long as the peak temperature does not exceed +225°C. Peak reflow

temperature (≥ 220°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed

40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow

profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that

the internal crystal is not exposed to temperatures above +150°C.

Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package

label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-

sensitive device (MSD) classifications.

THERMAL INFORMATION

PACKAGE TYPE

(°C/W)

(°C/W)

16-pin SO (300 mils)

73

23

36-pin BGA

43.9

18.4

PACKAGE INFORMATION

(For the latest package information, go to www.maxim-ic.com/DallasPackInfo.)

PACKAGE TYPE

DOCUMENT NO.

14-pin Encapsulated DIP

56-G0001-002

16-pin SO (300 mils)

56-G4009-001

36-pin BGA

56-G6023-001