EMIF02-MIC03C2 datasheet(1/7 Pages) STMICROELECTRONICS

Part #	EMIF02-MIC03C2

Description	2 line EMI filter and ESD protection

PDF	7 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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1 / 7 page

November 2006

Rev 1

1/7

EMIF02-MIC03C2

2 line EMI filter and ESD protection

Main product characteristics

Where EMI filtering in ESD sensitive equipment is

required:

■ Mobile phones and communication systems

■ Computers and printers and MCU Boards

Description

The EMIF02-MIC03C2 is a highly integrated

device designed to suppress EMI/RFI noise in all

systems subjected to electromagnetic

interference. The Flip-Chip packaging means the

package size is equal to the die size.

This filter includes ESD protection circuitry, which

prevents damage to the application when it is

subjected to ESD surges up to 15 kV.

Benefits

■ EMI symmetrical (I/O) low-pass filter

■ High efficiency EMI filter (-35 dB @ 900 MHz)

■ Very low PCB space consumption:

1.07 mm x 1.47 mm

■ Very thin package: 0.695 mm

■ Coating resin on back side and lead free

package

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging.

Pin configuration (Bump side)

Complies with following standards:

IEC 61000-4-2

MIL STD 883G - Method 3015-7 Class 3

level 4 input pins

15 kV

(air discharge)

8 kV

(contact discharge

level 1 output pins

2 kV

(air discharge)

2 kV

(contact discharge

Coated Flip-Chip package

(about 20 times real size)

B

1

32

C

A

I1

O1

GND

I2

O2

www.st.com

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EMIF02-MIC03C2 Datasheet(PDF) 1 Page - STMicroelectronics

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