MBR30170MFS

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4

TYPICAL CHARACTERISTICS

Figure 7. Typical Junction Capacitance

Figure 8. Average Forward Power Dissipation

VR, REVERSE VOLTAGE (V)

IF(AV), AVERAGE FORWARD CURRENT (A)

100

10

1

0.1

10

100

1K

10K

30

25

20

15

10

5

0

0

5

10

15

20

25

TJ = 25°C

D = 0.5

D = 0.3

D = 0.2

DC

TJ = 175°C

Square Wave

Figure 9. Typical Thermal Characteristics, Junction−to−Ambient

PULSE TIME (sec)

0.001

10

10

100

(Assume 600 mm2, 1 oz. copper bond pad on a FR4 board)

1

100

1

0.1

1000

0.1

0.01

0.001

0.0001

0.00001

0.000001

Single Pulse

50% Duty Cycle

20%

10%

5%

2%

1%

0.01