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PIC18F258-E/LSQTP Datasheet(PDF) 334 Page - Microchip Technology

Part # PIC18F258-E/LSQTP
Description  28/40-Pin High-Performance, Enhanced Flash Microcontrollers with CAN Module
PDF  402 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC18F258-E/LSQTP Datasheet(HTML) 334 Page - Microchip Technology

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PIC18FXX8
DS41159E-page 332
© 2006 Microchip Technology Inc.
27.1
DC Characteristics
PIC18LFXX8
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
PIC18FXX8
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
-40°C
≤ TA ≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min
Typ
Max Units
Conditions
VDD
Supply Voltage
D001
PIC18LFXX8
2.0
—
5.5
V
HS, XT, RC and LP Oscillator modes
D001
PIC18FXX8
4.2
—
5.5
V
D002
VDR
RAM Data Retention
Voltage(1)
1.5
—
—
V
D003
VPOR
VDD Start Voltage
to ensure internal
Power-on Reset signal
—
—
0.7
V
See section on Power-on Reset for details
D004
SVDD
VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05
—
—
V/ms See section on Power-on Reset for details
VBOR
Brown-out Reset Voltage
PIC18LFXX8
D005
BORV1:BORV0 = 11 1.96
—
2.16
V
BORV1:BORV0 = 10 2.64
—
2.92
V
BORV1:BORV0 = 01 4.07
—
4.59
V
BORV1:BORV0 = 00 4.36
—
4.92
V
PIC18FXX8
D005
BORV1:BORV0 = 1x N.A.
—
N.A.
V
Not in operating voltage range of device
BORV1:BORV0 = 01 4.07
—
4.59
V
BORV1:BORV0 = 00 4.36
—
4.92
V
Legend: Rows are shaded for improved readability.
Note 1:
This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM
data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).
4:
For RC oscillator configuration, current through REXT is not included. The current through the resistor can
be estimated by the formula Ir = VDD/2 REXT (mA) with REXT in kOhm.
5:
The LVD and BOR modules share a large portion of circuitry. The
ΔIBOR and ΔILVD currents are not
additive. Once one of these modules is enabled, the other may also be enabled without further penalty.



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