PIC18F258-ESLASHLSQTP datasheet(335/402 Pages) MICROCHIP

335 / 402 page

DS41159E-page 333

PIC18FXX8

IDD

Supply Current(2,3,4)

D010

PIC18LFXX8

—

1.7

2.5

1.8

2.5

XT oscillator configuration

VDD = 2.0V, +25°C, FOSC = 4 MHz

VDD = 2.0V, -40°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz

RC oscillator configuration

VDD = 2.0V, +25°C, FOSC = 4 MHz

VDD = 2.0V, -40°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz

RCIO oscillator configuration

VDD = 2.0V, +25°C, FOSC = 4 MHz

VDD = 2.0V, -40°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz

D010

PIC18FXX8

—

1.7

2.5

1.8

XT oscillator configuration

VDD = 4.2V, +25°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +125°C, FOSC = 4 MHz

RC oscillator configuration

VDD = 4.2V, +25°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +125°C, FOSC = 4 MHz

RCIO oscillator configuration

VDD = 4.2V, +25°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40°C to +125°C, FOSC = 4 MHz

D010A

PIC18LFXX8

—18

μA

LP oscillator, FOSC = 32 kHz, WDT disabled

VDD = 2.0V, -40°C to +85°C

D010A

PIC18FXX8

—

150

180

μA

LP oscillator, FOSC = 32 kHz, WDT disabled

VDD = 4.2V, -40°C to +85°C

VDD = 4.2V, -40°C to +125°C

27.1

DC Characteristics (Continued)

PIC18LFXX8

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

PIC18FXX8

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

-40°C

≤ TA ≤ +125°C for extended

Param

No.

Symbol

Characteristic/

Device

Min

Typ

Max Units

Conditions

Legend: Rows are shaded for improved readability.

Note 1:

This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM

data.

The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as specified.

The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is

measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS

and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).

For RC oscillator configuration, current through REXT is not included. The current through the resistor can

be estimated by the formula Ir = VDD/2 REXT (mA) with REXT in kOhm.

The LVD and BOR modules share a large portion of circuitry. The

ΔIBOR and ΔILVD currents are not

additive. Once one of these modules is enabled, the other may also be enabled without further penalty.

PIC18F258-E/LSQTP Datasheet(PDF) 335 Page - Microchip Technology

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