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ASM330LHBG1 Datasheet(PDF) 114 Page - STMicroelectronics |
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ASM330LHBG1 Datasheet(HTML) 114 Page - STMicroelectronics |
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114 / 130 page ![]() 14 Soldering information The LGA package is compliant with the ECOPACK and RoHS standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. For land pattern and soldering recommendations, consult technical note TN0018 available on www.st.com. ASM330LHBG1 Soldering information DS14080 - Rev 1 page 114/130 |
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