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LP3950 Datasheet(PDF) 25 Page - National Semiconductor (TI) |
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LP3950 Datasheet(HTML) 25 Page - National Semiconductor (TI) |
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25 / 31 page ![]() Recommended External Components OUTPUT CAPACITOR, C OUT The output capacitor C OUT directly affects the magnitude of the output ripple voltage. In general, the higher the value of C OUT, the lower the output ripple magnitude. Multilayer ce- ramic capacitors with low ESR (Equivalent Series Resis- tance) are the best choice. At the lighter loads, the low ESR ceramics offer a much lower V OUT ripple than the higher ESR tantalums of the same value. At the higher loads, the ceramics offer a slightly lower V OUT ripple magnitude than the tantalums of the same value. However, the dv/dt of the V OUT ripple with the ceramics is much lower that the tantal- ums under all load conditions. Capacitor voltage rating must be sufficient, 10V is recommended. Some ceramic capacitors, especially those in small packages, exhibit a strong capacitance reduction with the increased applied voltage. The capacitance value can fall to below half of the nominal capacitance. Too low output capacitance can make the boost converter unstable. INPUT CAPACITOR, C IN The input capacitor C IN directly affects the magnitude of the input ripple voltage and to a lesser degree the V OUT ripple. A higher value C IN will give a lower VIN ripple. Capacitor volt- age rating must be sufficient, 10V is recommended. OUTPUT DIODE, D 1 A Schottky diode should be used for the output diode. To maintain high efficiency the average current rating of the schottky diode should be larger than the peak inductor cur- rent ( A1.0A). Schottky diodes with a low forward drop and fast switching speeds are ideal for increasing efficiency in portable applications. Choose a reverse breakdown of the schottky diode larger than the output voltage. Do not use ordinary rectifier diodes, since slow switching speeds and long recovery times cause the efficiency and the load regu- lation to suffer. INDUCTOR, L 1 LP3950’s high switching frequency enables the use of a small surface mount inductor. A 4.7 µH shielded inductor is suggested for 2.0 MHz switching frequency. Values below 2.2 µH should not be used at 2.0 MHz. At lower switching frequencies 4.7 µH inductors should always be used. The inductor should have a saturation current rating higher than the peak current it will experience during circuit operation ( A1.0A). Less than 300 m Ω ESR is suggested for high efficiency. Open core inductors cause flux linkage with circuit components and, thus, may interfere with the normal opera- tion of the circuit. This should be avoided. For high efficiency, choose an inductor with a high frequency core material such as ferrite to reduce the core losses. To minimize radiated noise, use a toroid, pot core or shielded core inductor. The inductor should be connected to the SW pin as close to the IC as possible. Examples of suitable inductors are TDK type VLF4012AT- 4R7M1R1 and Coilcraft type MSS4020- 472MLD. List of Recommended External Components Symbol Symbol Explanation Value Unit Type C VDD1 V DD1 Bypass Capacitor 100 nF Ceramic, X5R C VDD2 V DD2 Bypass Capacitor 100 nF Ceramic, X5R C OUT Output Capacitor from FB to GND 10 ± 10% µF Ceramic, X5R C IN Input Capacitor from Battery Voltage to GND 10 ± 10% µF Ceramic, X5R C VDDIO V DD_IO Bypass Capacitor 100 nF Ceramic, X5R C VDDA V DDA Bypass Capacitor 100 nF Ceramic, X5R C 1,2,3 Audio Input Capacitors 10 nF Ceramic, X5R R T Oscillator Frequency Bias Resistor 82 k Ω 1% (Note 19) R SO SO Output Pull-up Resistor 100 k Ω C VREF Reference Voltage Capacitor, between V REF and GND 100 nF Ceramic, X5R L 1 Boost Converter Inductor 4.7 µH Shielded, Low ESR, I SAT A1.0A D 1 Rectifying Diode, V F @ Maxload 0.3 V Schottky Diode RGB LED User Defined Red, Green, Blue or White LEDs R RX,RGX,RBX Current Limit Resistors Note 19: Resistor RT tolerance change will change the timing accuracy of RGB block. Also the boost converter switching frequency will be affected. PCB Design Guidelines Printed circuit board layout is critical to low noise operation and good performance of the LP3950. Bypass capacitors should be close to the V DD pins of the integrated circuit. Special attention must be given to the routing of the switch- ing loops. Lengths of these loops should be minimized. It is essential to place the input capacitor, the output capacitor, the inductor and the schottky diode very close to the inte- grated circuit and use wide routings for those components. Sensitive components should be placed far from those com- ponents with high pulsating current. A ground plane is rec- ommended. The power switch loop (the switch is on) has the greatest affect on noise generation. The loop is formed by the input www.national.com 25 |
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