AS7058

Electrical characteristics

Short Datasheet

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Symbol

Parameter

Min

Max

Unit

Comments

VDGND-AGND

Digital to analog ground

voltage difference

-0.3

0.3

V

ILEDON

Average LED ON Current

35

mA

ISCR

Input current (latch-up

immunity)

± 100

mA

JEDEC JESD78E

Electrostatic Discharge

ESDHBM

Electrostatic discharge HBM

± 2

kV

JS-001-2017

ESDCDM

Electrostatic discharge CDM

± 500

V

JS-002-2018

Temperature Ranges and Storage Conditions

TA

Operating ambient

temperature

-40

85

°C

TSTRG

Storage temperature range

-40

125

°C

TBODY

Package body temperature

260

°C

IPC/JEDEC J-STD-020 (1)

RHNC

Relative humidity (non-

condensing)

5

85

%

MSL

Moisture sensitivity level

1

According to JEDEC J-STD-

020E

Represents a max. floor life

time of unlimited

tSTRG DOF

Storage time for DOF/die or

wafers on foil

3

months

Refers to indicated date of

packing

(1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020

“Moisture/Reflow

Sensitivity Classification for Nonhermetic Solid State Surface Mount

Devices.” The lead finish for Pb-free leaded packages is

“Matte Tin” (100 % Sn).

4

Electrical characteristics

All limits are guaranteed. The parameters with Min and Max values are guaranteed with

production tests or SQC (Statistical Quality Control) methods.

Conditions: TA = 25 °C, VDVDD = 1.8 V, VAVDD = 1.8 V, VIOVDD = 1.8 V

Table 3: Electrical characteristics of AS7058

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

VDVDD

Digital supply

voltage

1.70

1.80

1.98

V

VAVDD

Analog supply

voltage

1.70

1.80

1.98

V

VIOVDD

IO supply voltage

1.08

1.80

1.98

V