FlipStack® CSP technology enables the stacking of a wide range of different

semiconductor devices to deliver the high level of silicon integration and

area efficiency required in portable multi-media products. This type of

packaging uses high density thin core substrates, advanced wafer thinning,

die attach, flip chip and wire bonding capabilities to stack multiple devices

in a conventional fine pitch BGA (FBGA) surface mount package.

Many customers have relied on Amkor to solve their highest density

and most complex device stack combinations. As a result, Amkor has

established industry leadership in stacking complex mixed signal, logic +

memory devices, including digital base band or application/processors +

high density flash or mobile DRAM devices. Designers are looking to

FlipStack® CSP technologies to achieve integration, size and cost reductions

in chip set combinations.

Applications

FlipStack® CSP technology enables smaller, lighter and more innovative

new product form factors at a lower cost. This solution addresses a range

of design requirements, and enables a wide variety of applications, including

portable multimedia devices such as tablets, cell phones and digital cameras.

Reliability Qualification

Amkor assures reliable performance by continuously monitoring key

indices.

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Moisture resistance testing: JEDEC level 3 @ 260°C

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Biased/Unbiased HAST: 121°C/100% RH, 2 atm, 192 hours

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Temp/Humidity: 85°C/85% RH, 1000 hours

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Temp cycle: -55°C/+125°C, 1000 cycles

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High temp storage: 150°C, 1000 hours

Board Level

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Thermal cycle: -40°C/+125°C, 1000 cycles

Test Services

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Program generation/conversion

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Product engineering

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Wafer sort

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-55°C to +165°C test available

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Burn-in capabilities

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Tape and reel services

The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray®

Ball Grid Array (CABGA) manufacturing capabilities, in combination

with Amkor’s fcCSP technology. This broad high-volume infrastructure

enables the rapid deployment of advances in die stacking technology

across multiple products and factories to achieve lowest total cost.

FlipStack® CSP

DATA SHEET | LAMINATE PRODUCTS

FEATURES

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Package height down to 0.6 mm

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Design, assembly and test capabilities

that enable stacking combinations of

memory, logic and mixed signal type

devices

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Established package infrastructure

with standard CABGA and fcCSP

footprints

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Consistent product performance with

high yields and reliability

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Die overhang wirebonding

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Low loop wirebonding to 40 µm or

less

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Pb-free, RoHS compliant and green

materials

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Passive component integration

options

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JEDEC standard outlines including

MO-192, MO-195, MO-216, MO-219

and MO-298