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Benefits

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Cost-effective: Eliminates the need for an

interposer, reducing package costs

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Electrical Performance: Offers better impedance

control, lower insertion loss, and less warpage,

resulting in improved electrical performance

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High I/O Counts: Supports packages with over

1000 I/Os, making it ideal for networking and server

applications

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Time to Market: Leveraging existing fan-out/flip

chip techniques, this technology accelerates

time to market

Applications

S-SWIFT™ technology is well-suited for applications

that require large package sizes and high I/O density

(>1000).

Key applications include

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High Performance Computing (HPC): Enhances

HPC applications by efficiently achieving critical

interconnections

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Networking and Server Applications: High I/O

density makes S-SWIFT ideal for networking and

server needs

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Artificial Intelligence (AI): Exceptional electrical

performance and high-speed, low-latency chip-to-

chip interconnect are perfect for AI applications

requiring significant memory and compute power

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ASICs and HBMs: The chip-last technology of

S-SWIFT is suitable for packaging ASICs and HBMs

S-SWIFT™ technology offers lower costs compared

to 2.5D, a thinner package, reduced insertion loss,

improved impedance control, and lower warpage,

resulting in superior electrical performance. These

advantages make S-SWIFT a compelling choice for

relevant applications.

S-SWIFTTM Technology

S-SWIFT™ Cross Section

Substrate SWIFT® Technology

Metal Lid

Molded Logic +

HBM Module

RDL (SWIFT) Interposer

Passive Components

Organic Substrate

with Lid Adhesive

Solder Ball Grid Array