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HMX2000 Datasheet(PDF) 1 Page - Honeywell Solid State Electronics Center

Part # HMX2000
Description  MIXED SIGNAL SOI GATE ARRAYS
PDF  2 Pages
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Manufacturer  HONEYWELL [Honeywell Solid State Electronics Center]
Direct Link  http://honeywell.com/Pages/Home.aspx
Logo HONEYWELL - Honeywell Solid State Electronics Center

HMX2000 Datasheet(HTML) 1 Page - Honeywell Solid State Electronics Center

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MIXED SIGNAL SOI GATE ARRAYS
HMX2000
FAMILY
Features
General Description
Fabricated on Honeywell’s RICMOSTM IV Silicon
On Insulator (SOI) process
-
0.8 m Process (Leff = .65 m)
HMX2000 supports 5V operation
TTL, CMOS, Cold Spare compatible I/O
3 or 4 layer metal interconnect
Compatible with existing HX2000 digital gate arrays
-
Sea-Of-Gates flow around embedded cells
-
Memory, A/D, D/A and other cores available
Up to 275,000 gates useable
Typical gate toggle power 0.6 W/MHz/gate
Analog on SOI provides 10dB lower substrate noise
than bulk CMOS at 1GHz, 25dB lower at 100 MHz
NMOS Ft = 15 GHz
CrSi resistor, 2500 /square 20%
-
300 ppm/ C temperature coefficient
Linear Capacitors
-
100ppm/Volt, 0.5fF/ m2
Vt~0.8V
DMOS: NMOS AND PMOS > 20 Volts Breakdown
Lateral Bipolar: >20
Inductors (Metal Spiral) Q~2-5, 2-5nH
Body terminal fully oxide-isolated from substrate
Ring Oscillator Speed ~ 150 psec/stage
Total Dose Hardness > 1M Rad(Si)
No Latchup
Future enhancements
3.3V digital supply and I/O
The HMX2000 family of arrays incorporate Mixed Signal
capability as an extension of the available HX2000 Gate
Array family, fabricated on Honeywell’s RICMOSTM IV
Silicon On Insulator (SOI) process. The SOI-IV process at
Honeywell has performance advantages over bulk silicon
CMOS in that 25% to 35% higher speeds can be obtained
or up to 30% lower power. The SOI substrate can support a
6X improvement in static noise margins and significantly
lower subthreshold leakage current.
Each HMX2000 array design is founded on our proven
SOI ASIC library of SSI and MSI logic elements, available
core IP (intellectual property), integratable passives, and
selectable I/O pads. This family is fully compatible with
Honeywell’s range of high reliability screening, test and
packaging options.
Designers can choose from a wide variety of I/O types.
Output buffer options include 8 drive strengths,
CMOS/TTL levels, IEEE 1149.1 boundry scan, pull-
up/pull-down resistors, and tri-state capability. Input
buffers can be selected for CMOS/TTL/Schmitt trigger
levels, IEEE 1149.1 boundry scan and pull-up/pull-down
resistors. Bi-directional buffers are also available.
_________________________________________________________________________________________________________
Solid State Electronics Center 12001 State Highway 55, Plymouth, MN 55441 (800) 323-8295 http://www.ssec.honeywell.com


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