HMX2000

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Building blocks

8-bit, 8-channel A/D converter

12-bit current-output DAC

Laser-trimmed precision voltage reference

General purpose opamp, bias generators

PLL, 2 versions, 50 –180 MHz

Misc. Amplifiers

Comparators

Analog Output Buffer

SPICE models, Custom Cell Design Services

SPECIFICATIONS

HMX2000 Characteristics

Maximum gate count and I/O

275,000 useable gates and 388 signal I/O

Typical delay – 2 input NAND

270 ps @ 5.0V

I/O interface levels

TTL, CMOS, Schmitt trigger

Typical power consumption, W/MHz/gate

0.6 @ 5.0V

Operating temperature range

-55 C to +125 C

Minimum Geometry

Analog supply level

5.0V

NMOS -

~ 1.0 mV (large devices)

PMOS -

~ 1.5 mV (large devices)

Poly resistor characteristics

250 ppm/ C, 250 A/ m RMS current density,

100 /square 30%

P-well resistor characteristics

2500 ppm/ C, 20 A/ m RMS current density,

-2000 ppm/V, 2500 /square, 35%

Linear capacitor characteristics

The HMX2000 family has a cold sparing feature to

allow a chip level power down mode, in which the

associated busses connected to the chip can remain

active. This high impedance off-state buffer feature

allows users to power down portions of their system

for power savings.

provide the necessary guidance to achieve first pass

design success. The VDS design kit supports

industry leading Electronic Design Automation tools

including those offered by Mentor Graphics,

Synopsys, and Cadence. Honeywell can perform

design translations to the HMX2000 ASIC family

from other Computer Aided Design platforms.

Customers may use familiar CAD tools and libraries

to map existing designs to Honeywell library

components.

Any analog tools capable of SPICE simulation can

be used to design the analog part of the mixed mode

design. Honeywell will provide SOI-IV Mixed

Signal Design Guidelines to assist users in the

design of analog functions. The basic technology

parameters such as capacitance, sheet resistance,

maximum operating voltage and electromigration

limits along with BSIM device models are

documented in the SOI-IV Electrical Rules and are

available to designers.

Honeywell assigns a Customer Design Engineer to

each

ASIC

program

to

provide

technical

assistance, telephone support, and to coordinate

the design through mask release. A project

manager is also assigned to communicate fab, test

and package assembly status. The HMX2000

mixed mode ASIC family provides customers with

an integration capability that can improve system

performance while reducing power and provides

system cost savings.

To learn more about

Honeywell’s variety of custom and semi-custom

IC products, call us at 763-954-2888.

Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design.

Honeywell does not assume any liability arising out of the application or use of any product or circuit described herein: neither does it

convey any license under its patent rights nor the rights of others. 11/01

900300

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