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ST7263BHX Datasheet(PDF) 128 Page - STMicroelectronics |
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ST7263BHX Datasheet(HTML) 128 Page - STMicroelectronics |
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128 / 145 page ![]() ST7263BDx ST7263BHx ST7263BKx ST7263BE 128/145 15 Package characteristics In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level in- terconnect. The category of second Level Inter- connect is marked on the package and on the in- ner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to solder- ing conditions are also marked on the inner box la- bel. ECOPACK is an ST trademark. ECOPACK speci- fications are available at: www.st.com 15.1 Package mechanical data Figure 76. 34-pin Plastic Small Outline Package, shrink 300-mil width Dim. mm inches Min Typ Max Min Typ Max A 2.464 2.642 0.097 0.104 A1 0.127 0.292 0.005 0.012 B 0.356 0.483 0.014 0.019 C 0.231 0.318 0.009 0.013 D 17.72 9 18.05 9 0.698 0.711 E 7.417 7.595 0.292 0.299 e 1.016 0.040 H 10.16 0 10.41 4 0.400 0.410 h 0.635 0.737 0.025 0.029 α 0° 8° 0° 8° L 0.610 1.016 0.024 0.040 Number of Pins N 34 h x 45× C L a A A1 e B D H E |
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