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ST7263BHX Datasheet(PDF) 131 Page - STMicroelectronics |
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ST7263BHX Datasheet(HTML) 131 Page - STMicroelectronics |
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131 / 145 page ![]() ST7263BDx ST7263BHx ST7263BKx ST7263BE 131/145 15.2 Thermal characteristics Notes: 1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings value Unit RthJA Package thermal resistance (junction to ambient) SDIP32 SO34 SO24 LQFP48 QFN40 60 75 70 80 34 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C |
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