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HM1-6514S/883 Datasheet(PDF) 9 Page - Renesas Technology Corp |
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HM1-6514S/883 Datasheet(HTML) 9 Page - Renesas Technology Corp |
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9 / 9 page ![]() HM-6514/883 FN2996 Rev.1.00 Page 9 of 9 March 1997 Die Characteristics DIE DIMENSIONS: 136 x 167 x 19 1mils METALLIZATION: Type: Si - Al Thickness: 11k Å 2kÅ GLASSIVATION: Type: SiO2 Thickness: 8k Å 1kÅ WORST CASE CURRENT DENSITY: 1.79 x 105 A/cm2 LEAD TEMPERATURE (10s soldering): 300oC Metallization Mask Layout HM-6514/883 NOTE: 1. Pin numbers correspond to DIP Package only. A5 A6 VCC A7 A8 A9 A0 A1 A2 E GND W DQ3 DQ2 DQ1 DQ0 A4 A3 |
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