3

®

DAC7612

PIN CONFIGURATION

Top View

SO-8

VDD to GND .......................................................................... –0.3V to 6V

Digital Inputs to GND .............................................. –0.3V to VDD + 0.3V

VOUT to GND ........................................................... –0.3V to VDD + 0.3V

Power Dissipation ........................................................................ 325mW

Thermal Resistance,

θ

JA ........................................................... 150°C/W

Maximum Junction Temperature .................................................. +150

°C

Operating Temperature Range ...................................... –40

°C to +85°C

Storage Temperature Range ....................................... –65

°C to +150°C

Lead Temperature (soldering, 10s) .............................................. +300

°C

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

ABSOLUTE MAXIMUM RATINGS(1)

PIN DESCRIPTIONS

PIN

LABEL

DESCRIPTION

1

SDI

Serial Data Input. Data is clocked into the internal

serial register on the rising edge of CLK.

2

CLK

Synchronous Clock for the Serial Data Input.

3

LOADDACS

Loads the internal DAC registers. All DAC registers

are transparent latches and are transparent when

LOADDACS is LOW (regardless of the state of CS

or CLK).

4

CS

Chip Select. Active LOW.

5VOUTB

DAC B Output Voltage

6

GND

Ground

7VDD

Positive Power Supply

8VOUTA

DAC A Output Voltage

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

PACKAGE/ORDERING INFORMATION

MINIMUM

RELATIVE

DIFFERENTIAL

SPECIFICATION

PACKAGE

ACCURACY

NONLINEARITY

TEMPERATURE

DRAWING

ORDERING

TRANSPORT

PRODUCT

(LSB)

(LSB)

RANGE

PACKAGE

NUMBER(1)

NUMBER(2)

MEDIA

DAC7612U

±2

±1

–40

°C to +85°C

SO-8

182

DAC7612U

Rails

""

"

"

""

DAC7612U/2K5

Tape and Reel

DAC7612UB

±1

±1

–40

°C to +85°C

SO-8

182

DAC7612UB

Rails

""

"

"

""

DAC7612UB/2K5

Tape and Reel

NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are

available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “DAC7612U/2K5” will get a single

2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.

1

2

3

4

8

7

6

5

SDI

CLK

LOADDACS

CS

V

OUTA

V

DD

GND

V

OUTB

DAC7612U