LM2756

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SNVS504C – JULY 2007 – REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

VIN pin voltage

-0.3V to 6.0V

SCL, SDIO, HWEN pin voltages

-0.3V to (VIN+0.3V)

w/ 6.0V max

IDxx Pin Voltages

-0.3V to (VVOUT+0.3V)

w/ 6.0V max

Continuous Power Dissipation

Internally Limited

(4)

Junction Temperature (TJ-MAX)

150°C

Storage Temperature Range

-65°C to +150° C

Maximum Lead Temperature (Soldering)

(5)

ESD Rating(6)

Human Body Model

2.0kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

All voltages are with respect to the potential at the GND pins.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and

disengages at TJ = 155°C (typ.).

(5)

For detailed soldering specifications and information, please refer to TI Application Note 1112: Micro SMD Wafer Level Chip Scale

Package (AN-1112) SNVA009.

(6)

The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Operating Rating

(1) (2)

Input Voltage Range

2.7V to 5.5V

LED Voltage Range

2.0V to 4.0V

Junction Temperature (TJ) Range

-30°C to +105°C

Ambient Temperature (TA) Range

(3)

-30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

105°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal

Resistance (

θJA),

40°C/W

YFQ0020 Package

(1)

(1)

Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to TI

Application Note 1112: Micro SMD Wafer Level Chip Scale Package (AN-1112) SNVA009.

Electrical Characteristics

(1) (2)

Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.

Unless otherwise specified: VIN = 3.6V; VHWEN = VIN; VDxA = VDxB = VDxC = 0.4V; RSET = 11.8kΩ; GroupA = GroupB = GroupC

= Fullscale Current; ENA, ENB, ENC Bits = “1”; SD53, SD62, 53A, 62A Bits = "0"; C1 = C2 = CIN= COUT= 1.0µF;

(1)

All voltages are with respect to the potential at the GND pins.

(2)

Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the

most likely norm.

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