LMV1099

SNAS490D – JULY 2010 – REVISED MAY 2013

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Absolute Maximum Ratings

(1) (2)

Supply Voltage

6.0V

Storage Temperature

-85°C to +150°C

ESD Rating (HBM)(3)

2000V

ESD Rating (MM)(4)

200V

ESD Rating (CDM)(5)

750V

Junction Temperature (TJMAX)

150°C

Mounting Temperature

Infrared or Convection (20 sec.)

235°C

Thermal Resistance

θJA (DSBGA)

(6)

70°C/W

Soldering Information

See AN-1112 “microSMD Wafers

Level Chip Scale Package.”

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All

voltages are measured with respect to the ground pin, unless otherwise specified.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human body model, applicable std. JESD22-A114C.

(4)

Machine model, applicable std. JESD22-A115-A.

(5)

Charge device model, applicable std. JESD22-C101D.

(6)

The maximum power dissipation must be de-rated at elevated temperatures and is dictated by TJMAX, θJC, and the ambient temperature

TA. The maximum allowable power dissipation is PDMAX = (TJMAX – TA) / θJA or the number given in the Absolute Maximum Ratings,

whichever is lower.

Operating Ratings

(1)

Supply Voltage

2.7V

≤ VDD ≤ 5.5V

1.7V

≤ I2CVDD ≤ 5.5V

I2CVDD

I2CVDD ≤ VDD

TMIN ≤ TA ≤ TMAX

−40°C ≤ TA ≤ +85°C

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All

voltages are measured with respect to the ground pin, unless otherwise specified.

Electrical Characteristics VDD = 3.6V

(1)

Unless otherwise specified, all limits specified for TA = 25°C, VDD = 3.6V, EN = VDD. For Uplink tests, unless otherwise

specified, preamplifier gain = 20dB, post amplifier gain = 6dB, VIN = 18mVP-P, f = 1kHz, RL = 100kΩ, CL = 4.7pF and in pass-

through mode. For Downlink tests, unless otherwise specified, f = 1kHz, RL = 32Ω, AGCAV = 0dB.

LMV1099

Units

Symbol

Parameter

Conditions

(Limits)

Typical(2)

Limit(3)

GENERAL SPECIFICATIONS

IDDQ

Supply Quiescent Current

VIN = 0V

3.8

4.5

mA (max)

ISD

Shutdown Current

EN pin is Low

0.06

1

μA (max)

TON

IC Wake-up Time

27

40

ms (max)

VIH

Logic High Input Threshold

EN, SCL, SDA

0.7xI2CVDD

V (min)

VIL

Logic Low Input Threshold

EN, SCL, SDA

0.3xI2CVDD

V (max)

UPLINK SPECIFICATIONS

f = 1kHz (See Test Methods)

33

dB (min)

FFNSE

Far Field Noise Suppression (Electrical)

27.5

f = 300Hz (See Test Methods)

42

dB (min)

(1)

The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as

otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and

are not ensured.

(2)

Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of

product characterization and are not ensured.

(3)

Datasheet min/max specification limits are specified by test or statistical analysis.

6

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