TLV2731, TLV2731Y

Advanced LinCMOS

 RAIL-TO-RAIL

LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

SLOS198A – AUGUST 1997 – REVISED MARCH 2001

1

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

D Output Swing Includes Both Supply Rails

D Low Noise . . . 15 nV/√Hz Typ at f = 1 kHz

D Low Input Bias Current ...1 pA Typ

D Fully Specified for Single-Supply 3-V and

5-V Operation

D Common-Mode Input Voltage Range

Includes Negative Rail

D High Gain Bandwidth ...2 MHz at

VDD = 5 V with 600 Ω Load

D High Slew Rate . . . 1.6 V/µs at VDD = 5 V

D Wide Supply Voltage Range

2.7 V to 10 V

D Macromodel Included

description

The TLV2731 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of

bandwidth and 1.6 V/

µs of slew rate for applications requiring good ac performance. The device exhibits

rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2731

is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.

The TLV2731, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of

high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels

combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing

applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great

choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600-

Ω loads for

telecom applications.

With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin

SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal

source, minimizing noise pick-up from long PCB traces.

AVAILABLE OPTIONS

TA

VIOmax AT 25°C

PACKAGED DEVICES

SYMBOL

CHIP

FORM‡

TA

VIOmax AT 25°C

SOT-23 (DBV)†

SYMBOL

FORM‡

(Y)

0

°C to 70°C

3 mV

TLV2731CDBV

VALC

TLV2731Y

–40

°C to 85°C

3 mV

TLV2731IDBV

VALI

TLV2731Y

† The DBV package available in tape and reel only.

‡ Chip forms are tested at TA = 25°C only.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DBV PACKAGE

(TOP VIEW)

5

4

3

1

2

IN +

VDD+

OUT

VDD– /GND

IN–

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Copyright

 2001, Texas Instruments Incorporated

Advanced LinCMOS is a trademark of Texas Instruments.