5

TS5MP645

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SCDS385B – JANUARY 2018 – REVISED JULY 2018

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Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage are with respect to ground, unless otherwise specified

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VDD

Supply Voltage

-0.5

6

V

VI/O

Analog voltage range (DxN, CLKN, DxP, CLKP, DAxN, CLKAN, DAxP, CLKAP, DBxN,

CLKBN, DBxP, CLKBP)

-0.5

4

V

VSEL , VOE Digital Input Voltage (SEL, OE)

-0.5

6

V

TJ

Junction temperature

-65

150

°C

Tstg

Storage temperature

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±250

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Supply Voltage

1.65

5.5

V

VI/O

Analog voltage range (DxN, CLKN, DxP, CLKP, DAxN, CLKAN, DAxP,

CLKAP, DBxN, CLKBN, DBxP, CLKBP)

0

3.6

V

VSEL, VOE

Digital Input Voltage (SEL, OE)

0

5.5

V

II/O

Continuous I/O current

-35

35

mA

TA

Operating ambient temperature

-40

85

°C

TJ

Junction temperature

-65

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TS5MP645

UNIT

YFP

36

RθJA

Junction-to-ambient thermal resistance

57.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.3

°C/W

RθJB

Junction-to-board thermal resistance

12.6

°C/W

ΨJT

Junction-to-top characterization parameter

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

12.7

°C/W