LM27951

C2+

VOUT

C1+

D4

CONNECT TO GND

PLANE

D3

D2

D1

C1-

GND

C2-

VIN

PWM

EN

ISET

13

LM27951

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SNVS416C – NOVEMBER 2005 – REVISED FEBRUARY 2016

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10 Layout

10.1 Layout Guidelines

The WSON is a leadframe-based chip scale package (CSP) with very good thermal properties. This package has

an exposed DAP (die attach pad) thermal pad at the center of the package measuring 3 mm × 1.6 mm. The main

advantage of this exposed DAP is to offer lower thermal resistance when it is soldered to the thermal land on the

PCB. For PCB layout, TI highly recommends a 1:1 ratio between the package and the PCB thermal land. To

further enhance thermal conductivity, the PCB thermal land may include vias to a ground plane. For more

detailed instructions on mounting WSON packages, refer to AN-1187 Leadless Leadframe Package (LLP)

SNOA401.

10.2 Layout Example

Figure 8. LM27951 Layout Example